Technical collatio: molere vs. Polishing

Technical collatio: molere vs. Polishing

Dimensio	Molitus	POLIENTIA
Core objective	Rectam Geometricos errores (glacies / rotunditatis), potestate dimensional accurate	Augendae superficies Glossa, eliminate Micro-scalpit, consequi speculum metam
Processus principium	Difficile abrasive particulas (E.G., Diamond Pectus, Silicon Carbide) Cutting remotionem	Flexible Medium (Polising Crustulum / Rota) Plastic Deformatio & Micro-Asperitas Flattening
Materia remotionem	Micron-Level (aspera / semi-consummatione)	Sub-micron (<0.1μm, consummatione)
AGRESSUS	Ra 0.025 ~ 0.006μm (Ultra-praecisione usque ad Nanoscale)	Ra 0.01 ~ 0.001μm (optical gradu <0.5nm)
Equipment / Tools	Grido / Belts / Discs (matched Abrasive Size & Denaress)	Polising rotarum (lana / polyurethane), Polying pastes (Alumina / Chromium cadmiae micropowders)
Processus parametri	Princeps pressura (0.01 ~ 0,1MPA), Minimum celeritatem (X ~ 30m / s)	Humilis pressura (<0.01MPA), High Volo (XXX ~ 100m / s)
Typical applications	Precisione mechanicarum partes, semiconductor laga pre-processus, optical elementum roughing	Optical lentium, exornantur partes (E.G .: Phone casibus), summus praecisione fingunt consummatione

Clavem differences

• Material remotionem mechanism:

1. Molere: durum abrasive "secans" (similis Micro-conversio).
2. Polising: Flexibile Medium "Ironing" Micro-Asperitates Via Plastic deformatio.

• Superficies species:

1. Dinding: Focuses in figura / dimensional disciplinam, Achieves Ra ~ 0.025μm.
2. Polising: focuses in optical perficientur, Achieves ra <0.001μm.

• Processus Tempus:

1. Dinding: Pre-consummavi gradus, providet basi superficiem ad politicam.
2. Polising: Final consummatione gradus, directe determinat ultima superficiem qualis.